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5G communication PCB Printed circuit boards used in 5G communications Featured Image

5G communication PCB Printed circuit boards used in 5G communications

Short Description:

1.Applications: Solid state drives

Number of layers: 12 layers (flexible 2 layers)

Minimum aperture: 0.2mm

Plate thickness: 1.6±0.16mm

Line width line distance: 3.5/4.5mil

Surface treatment: sunk nickel gold

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Product Description

5G communication1

Applications: Solid state drives
Number of layers: 12 layers (flexible 2 layers)
Minimum aperture: 0.2mm
Plate thickness: 1.6±0.16mm
Line width line distance: 3.5/4.5mil
Surface treatment: sunk nickel gold

5G communication2

Application field: 5G antenna (high frequency mixed voltage)
Number of floors: 4
Plate thickness: 1.2mm
Line width Line distance: /
Surface treatment: Tin

5G communication3

Application field: 5G antenna
Number of floors: 4
Plate thickness: 1.8±0.1mm
Line width line distance: 70.59/10mil
Surface treatment: Tin

5G communication4

Application field: communication server
Number of floors: 24
Plate thickness: 5.6mm
Line width line distance: 4/4mil
Surface treatment: Sunk gold

5G communication5

Application: Fingerprint softboard under the mobile screen
Type number: GRS02N09788B0
Number of floors: 2
Plate thickness: 0.10mm
Plate: Taihong 2FPDE0803MW
Line width line distance: 0.05mm
Minimum aperture: 0.15mm
Surface treatment: sunk nickel palladium

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