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Intelligent communication module PCB Printed circuit boards designed for intelligent communication modules used in various applications such as Internet of Things (IoT), wireless communication and data transmission
- Application: intelligent mobile terminal
- Number of layers: 12 layers of 3 level HDI board
- Plate thickness: 0.8mm
- Line width line distance: 2/2mil
- Surface treatment: gold +OSP
- Application: intelligent mobile terminal
- Layers: 10 ELIC
- Plate thickness: 0.8mm
- Line width line distance: 3/3mil
- Surface treatment: gold +OSP
- Application: intelligent navigation module
- Number of layers: 8 layers of 2-stage HDI boards
- Plate thickness: 1.0mm
- Line width line distance: 3/3mil
- Surface treatment: gold +OSP
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