| SMT assembly including BGA assembly | |
| Accepted SMD chips | 01005, BGA, QFP, QFN, TSOP | 
| Component height | 0.2-25mm | 
| Min packing | 0201 | 
| Min distance among BGA | 0.25-2.0mm | 
| Min BGA size | 0.1-0.63mm | 
| Min QFP space | 0.35mm | 
| Min assembly size | (X*Y) 50*30mm | 
| Max assembly size | (X*Y) 350*550mm | 
| Pick-placement precision | ±0.01mm | 
| Placement capability | 0805, 0603, 0402, 0201 | 
| High pin count press fit available | |
| SMT capacity per day | 2,000,000 point | 
 
		    
			 
		    
			| FOB Port | Shenzhen | 
| HTS Code | 8509.90.00 00 | 
| Lead Time | 15–30 days | 
 
		    
			 
             
             
             
             
            