One-stop Electronic Manufacturing Services, help you easily achieve your electronic products from PCB & PCBA

Firmware Decode PCB Copy PCB Clone PCB software develop PCBA Reversing Engineering Service

Short Description:

Application:

Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging

Insulation Materials:

Epoxy Resin, Metal Composite Materials, Organic Resin

Material:

Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber

Processing Technology:

Delay Pressure Foil, Electrolytic Foil


Product Detail

Product Tags

Key Specifications/ Special Features

Our Main Service

PCB &PCBA  Design

Components Sourcing

IC Programming

PCB fabrication

SMT  Building

DIP Production

PCBA Functional Test

Conformal Coating

Press Fit

COB Process

Laser Engraving

Box Building

Item

Paramter

Board Type:

Rigid PCB, Flexible PCB, metal core PCB,Rigid-Flex PCB

Board Shape:

Rectangular, Circular and any Odd Shapes

Size:

50*50mm~400mm * 1200mm

Min Package:

01005 (0.4mm*0.2mm),0201

Fine Pitch Parts:

0.25mm

BGA Package:

Dia. 0.14mm, BGA 0.2mm pitch

Mounting Accuracy:

±0.035mm(±0.025mm) Cpk≥1.0 (3σ)

SMT Capacity:

3 Million~4 Million Soldering Pad/day

DIP Capacity:

100 Thousand Pins/day

Assembly Capacity

100 Thousand Pins/day

Parts Sourcing:

All components sourced by Cmy, Partial sourcing, Kitted/Consigned

Parts Package:

Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk

Testing:

Visual inspection; AOI ; X-RAY ; Functional Testing,ICT

Types of Solder:

lead-free (RoHS Compliant) assembly services

Assembly Option:

From SMT to Assy,conformal coating ,Press fit

Stencils:

Laser cut stainless steel stencils,Nano stencil ,FG stencil

File Formats:

Bill of Materials,PCB(Gerber Files),Pick-N-Place File (XYRS)

Quality Grade:

IPC-A-610,IPC-A-600


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