Firmware Decode PCB Copy PCB Clone PCB software develop PCBA Reversing Engineering Service

Short Description:

Application:

Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging

Insulation Materials:

Epoxy Resin, Metal Composite Materials, Organic Resin

Material:

Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber

Processing Technology:

Delay Pressure Foil, Electrolytic Foil

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Product Detail

Product Tags

Key Specifications/ Special Features

Our Main Service

PCB &PCBA Design

Components Sourcing

IC Programming

PCB fabrication

SMT Building

DIP Production

PCBA Functional Test

Conformal Coating

Press Fit

COB Process

Laser Engraving

Box Building

Item	Paramter
Board Type:	Rigid PCB, Flexible PCB, metal core PCB,Rigid-Flex PCB
Board Shape:	Rectangular, Circular and any Odd Shapes
Size:	5050mm~400mm 1200mm
Min Package:	01005 (0.4mm*0.2mm),0201
Fine Pitch Parts:	0.25mm
BGA Package:	Dia. 0.14mm, BGA 0.2mm pitch
Mounting Accuracy:	±0.035mm(±0.025mm) Cpk≥1.0 (3σ)
SMT Capacity:	3 Million~4 Million Soldering Pad/day
DIP Capacity:	100 Thousand Pins/day
Assembly Capacity	100 Thousand Pins/day
Parts Sourcing:	All components sourced by Cmy, Partial sourcing, Kitted/Consigned
Parts Package:	Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk
Testing:	Visual inspection; AOI ; X-RAY ; Functional Testing,ICT
Types of Solder:	lead-free (RoHS Compliant) assembly services
Assembly Option:	From SMT to Assy,conformal coating ,Press fit
Stencils:	Laser cut stainless steel stencils，Nano stencil ,FG stencil
File Formats:	Bill of Materials，PCB(Gerber Files)，Pick-N-Place File (XYRS)
Quality Grade:	IPC-A-610,IPC-A-600