OEM PCBA Clone Assembly Service Other PCB & PCBA Custom Electronics PCB Circuit Board

Specification

PCB Technical Capacity

Layers Mass production: 2~58 layers / Pilot run: 64 layers

Max. Thickness Mass production: 394mil (10mm) / Pilot run: 17.5mm

Materials FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO,PPE, Hybrid, Partial hybrid, etc

Min. Width/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)

Max. Copper Thickness 6.0 OZ / Pilot run: 12OZ

Min. Hole Size Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

Surface Finish HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion , ENEPIG, Gold Finger

Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

PCBA technical Capacity

Advantages ----Professional Surface-mounting and Through-hole soldering technology

----Various sizes like 1206,0805,0603 components SMT technology

----ICT(In Circuit Test),FCT(Functional Circuit Test)

----PCB Assembly With UL,CE,FCC,Rohs Approval

----Nitrogen gas reflow soldering technology for SMT.

----High Standard SMT&Solder Assembly Line

----High density interconnected board placement technology capacity.

Components Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP

Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball

Testing Flying Probe Test,X-ray Inspection AOI Test