| Layers | 1-2 Layers |
| Finished Thickness | 16-134mil (0.4mm-3.4mm ) |
| Max. Dimension | 500mm *1200mm |
| Copper Thickness | 35um, 70um,1 to 10oZ |
| Min Line Width/Space | 4mil (0.1mm ) |
| Min Finished Hole Size | 0.95mm |
| Min. Drill Size | 1.00mm |
| Max. Drill Size | 6.5mm |
| Finished Hole Size Tolerance | ±0.050mm |
| Aperture Position Precision | ±0.076mm |
| Min SMT PAD Size | 0.4mm±0.1mm |
| Min.Solder Mask PAD | 0.05mm(2mil) |
| Min.Solder Mask Cover | 0.05mm(2mil) |
| Solder mask Thickness | >12um |
| Surface Finishing | HAL, HAL Lead free,OSP, Immersion Gold, etc |
| HAL Thickness | 5-12um |
| Immersion Gold Thickness | 1-3mil |
| OSP Film Thickness | ENTEK PLUS HT:0.3-0.5um; F2:0.15-0.3um |
| Outline Finishing | Routing & Punching; Precision Deviation ±0.10mm |
| Thermal Conductivity | 1.0 to 12w/m.k |
|
FOB Port |
Shenzhen |
|
Export Carton Dimensions L/W/H |
36 x 26 x 25 Centimeters |
|
Lead Time |
3–7 days |
|
Units per Export Carton |
5.0 |
|
Export Carton Weight |
18 Kilograms |